High-Quality Green Laser Marking Machine

Frequency‑doubled Nd: YVO₄ laser source. Wavelength: 532 nm (green). Beam quality near diffraction‑limited (M² < 1.3). Focused spot size: only 20‑25 µm. Compare that to a typical 1064 nm infrared laser – spot size 40‑60 µm. The green laser's smaller spot delivers twice the energy density for the same power. That concentration of energy? Line widths as narrow as 0.02 mm. Features invisible to the naked eye.

Pulsed mode. Pulse width less than 15 nanoseconds. Short pulse duration limits heat diffusion into surrounding material. Heat‑affected zone (HAZ) typically under 10 µm. For micro‑machining tasks – removing a thin conductive layer without damaging the substrate – this low thermal impact is essential. LGWL-10WSL keeps the heat where it belongs.

Medical devices. Surgical instruments, implants, catheter hubs. They often require tiny Data Matrix or QR codes for UDI (Unique Device Identification). Codes must stay readable after sterilization – autoclaving, EtO, radiation. Must resist bodily fluids. This machine creates high‑contrast marks on stainless steel, titanium, cobalt‑chrome alloys. No melting. No burrs. A 2 × 2 mm Data Matrix code (16 cells) takes less than 0.5 seconds to mark at 3000 mm/s scan speed. Each cell clearly delineated.

Micro‑text? Text smaller than 1 mm in height. Easy. Example: "LOT: 12345" in 0.5 mm characters on a polycarbonate medical connector. Marked without discoloration – thanks to the green laser's low thermal load. Marking field is 110 × 110 mm (standard). Optional 175 × 175 mm wide field. Galvanometer scanner positioning accuracy: ±10 µm. Complex patterns align perfectly. LGWL-10WSL handles the tiny stuff.

Removing a thin layer – paint, anodized coating, conductive film – without harming the base material. Common micro‑machining task. This machine excels. 532 nm wavelength is strongly absorbed by many coatings. Weakly absorbed by common substrates like glass, polyimide, certain metals. Adjust pulse repetition frequency (20‑200 kHz) and power (0‑100%). Precisely control removal depth.

Example: stripping a 10 µm thick ITO (indium tin oxide) layer from a glass touch sensor. Leaves the glass undamaged. Clean, straight edge. Same process? Remove paint from aluminum nameplates. Ablate passivation layer from copper pads without melting the underlying metal. Software includes "step‑and‑repeat" function for multiple identical workpieces. "Hatching" mode for uniform area removal. Removal speed for a 10 × 10 mm area of anodized coating? Typically 2‑3 seconds per pass. LGWL-10WSL is precise.

Widely used for direct part marking in the medical industry. Meets FDA UDI, EU MDR, GS1 standards. The green laser can mark:

• Stainless steel scalpels and forceps – dark, highly legible mark.
• Titanium bone screws and plates – light or dark mark, depending on parameters.
• Plastic luer connectors and syringe barrels – clean surface mark, no melting.
• Ceramic dental abutments – high‑contrast mark without micro‑cracking.

Non‑contact. No inks. No chemicals. No contamination risk. Marks are permanent. Resist autoclaving (134°C, 40 psi) and gamma radiation. LGWL-10WSL earns trust.

Full control over marking parameters. User‑friendly software. Power: 0‑100% (10 W maximum average). Pulse repetition frequency: 20‑200 kHz. Scan speed: up to 7000 mm/s. Number of passes: 1‑10 (field‑programmable). Q‑switch delay: adjustable for peak power optimization.

Typical QR code on stainless steel: 60% power, 80 kHz, 2000 mm/s, 1 pass. Micro‑text on anodized aluminum: 50% power, 100 kHz, 3000 mm/s, 1 pass. Thin‑film removal: lower power (30‑50%) and higher frequency (120‑200 kHz) to ablate layer by layer. LGWL-10WSL gives you control.

Cabinet dimensions: 800 × 850 × 1400 mm. Encloses laser source and marking area. Class I safety. Optional motorized XY stage – positioning accuracy ±5 µm. Automatic indexing of multiple parts. CCD camera with pattern recognition – mark‑on‑the‑fly alignment, even when parts are randomly placed. Supports file formats: PLT, DXF, AI, BMP, JPG, PNG. Built‑in serial number and date‑time generators.